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Intellectual Property & Awards

INTELLECTUAL PROPERTYAWARDS

Certificate of Grant of A Patent 

Certificate Number: MY-191318-A
Grant Date: 15/6/2022

Country: Malaysia

 

Trademark Amendment Certificate 

Certificate Number: 2012018638
Grant Date: 9/6/2022

Country: Malaysia

 

TTS Group has successfully registered as Shared Prosperity Organisation (SPO) 

Certificate Number: 016243
Grant Date: 3/6/2022

Country: Malaysia

 

TTS Group Trademark in China Class 9

Registration Number: 41924034
Grant Date: 7/8/2020

Country: China

 

TTS Group Trademark in Taiwan

Registration Number: 02061958
Grant Date: 01/06/2020

Country: Taiwan 

Industrial Design of Probe Pin with Wiping Effect - Taiwan

Registration Number: D190132
Grant Date: 01/05/2018
Country: Taiwan

Probe Pin - Malaysia

Registration Number: MY-17-E0271-0101
Grant Date: 22/08/2017
Country: Malaysia

TTS Group Trademark in China Class 9

Registration Number: 19796071
Grant Date: 21/06/2017
Country: China

Hand Socket Lid - Malaysia

Specification:

  • Reducing friction to allow smoother contact between two contact surfaces
  • Enabling high compression force to be effected by a single hand pain-free

Patent Number: MY-155594-A
Grant Date: 13/11/2015
Country: Malaysia

  

Hand Socket Lid - US

Specification:

  • Reducing friction to allow smoother contact between two contact surfaces
  • Enabling high compression force to be effected by a single hand pain-free.

Patent Number: US 8,523,591 B2
Grant Date: 3/9/2013
Country: US

  

Eco Contactor

Specification:

  • Provide epoxy-sealed contactor to achieve 100% shielding factor and insulative material inserted into the contactor to prevent the signal pins from being shorted to ground.
  • Improve shielding against electromagnetic and radio frequency interference in electronic devices reduced forces for attaining and maintaining effective shielding contact

US Patent Number: : 8,210,875 B2
Grant Date: 03/07/2012
Country: US

 

Hybrid Contactor

Specification:

  • Provide ground plane to shield the signal pin by a middle plate embedded in between to provide a more efficient control of the impedance of the pins and reduce the inductance of power pins
  • Reduce signal mismatch during signal transmission
  • Enhance overall performance of the probe pin in supporting high data transfer rate.

Patent Number: MY-145970-A
Grant Date: 31/05/2012
Country: Malaysia

  

Offset Taper Spring

Specification:

  • Reducing and stabilizing the electrical resistance
  • Prolonging the lifespan of probe pin

Patent Number: US 8083552 B2
Grant Date: 27/12/ 2011
Country: US
Patent Applied & Registered in Japan & Taiwan

  

Single Ended Flange Probe

Specification:

  • Improve probe construction rigidity with built-in flange for preload
  • Enable low electrical contact resistance and stability with single barrel body
  • Interchangeable plunger design
  • Longer pin lifespan

Patent Number: MY – 138796 - A
Grant Date: 31/07/2009
Country: Malaysia
Patent Applied & Registered in Japan & Taiwan

  

Single Ended Flange Probe

Specification:

  • Improve probe construction rigidity with built-in flange for preload
  • Enable low electrical contact resistance and stability with single barrel body
  • Interchangeable plunger design
  • Longer pin lifespan

Patent Number: MY – 138796 - A
Grant Date: 31/07/2009
Country: Malaysia
Patent Applied & Registered in Japan & Taiwan

  

BiTS China – Best Presentation

2016
TTSG has been awarded the best presentation for our technical presentation entitled "Study of Probe Pin Internal Resistance" during BiTS China held on 13th September, 2016. The presentation shared the results of the challenges in measuring the contact resistance between the parts in probe pins.

  

BiTS China – Premier Sponsor for the Second Year

2016
TTSG has received an award of appreciation for being a Premier Sponsor of BiTS China in Suzhou in 2016. This marked the second year that TTS Group has been the Premier Sponsor of this prominent event to share the latest insights in test strategies in the semiconductor and related industries.

  

Broadcom – Award for the Best in Class Sockets & Pins

2016
TTSG was honoured by Broadcom Infrastructure Networking Group's Physical Layer (PHY) with an award in recognition of our collaboration to deliver the best in class sockets & pins. The award reflected the confidence of our customers in the quality of our sockets and pins.

  

BiTS - Premier Sponsor

2015
TTSG sincerely appreciate the award received from BiTS in token of being a Premier Sponsor for the event held on 21st October, 2015. We believed the opportunity given in sponsoring BiTS Workshop event has opened the door for TTSG in comprehend our current market demand and the prospect of emerging the technology by providing quality products that meet our customer’s needs.

  

Broadcom Award - Top 500 Company

2012
TTSG has received an award from Broadcom Inc, a fortune 500 company, in recognition of our outstanding service and support to them. The recognition is yet another affirmation of TTSG’s capability in delivering its commitment of on-time delivery and consistent quality products to support our customer’s needs.

More Articles ...

2021

2021 Highlights

  • Phase 2 of Operation Headquarter completed
2020

2020 Highlights

  • Phase 1 of Operation Headquarter completed
2019

2019 Highlights

  • Commencement of 150,000 sqft. of Green Facilities
  • 100+ new machines ordered in the pipeline
2018

2018 Highlights

  • TTS Group has started to step foot into Mainland China, new office in Shanghai was introduced
2017

2017 Highlights

  • New multi-million Operation Headquarter in planning
2016

2016 Highlights

  • Consolidation of CNC production to one site for better production efficiency and cost effectiveness
  • Span off the PCB division to align with our mid to long term objective of focusing on probe pins and test socket business
2015

2015 Highlights

  • TTSG celebrates its 35 years of engineering success in the semiconductor test tooling industry. Our growth and progression have been made possible with the help and support of our stakeholders including our customers, employees, shareholders, community, and others. We would like to express our heartfelt gratitude to these individuals and institutions that have collaborated with us over the last 35 years.

    To mark this significant milestone, TTSG has launched a “Celebrating 35 Years” logo, which will appear on all TTSG’s marketing collateral.
2014

2014 Highlights

  • Test Tooling Solutions Group announced the merger and integration of Kenshi Singapore and rebrand the new entity under the Test Tooling Solutions Group, effective 1st Sept 2014.
    The merger is expected to further strengthen the core competency and technical capability of the combined unit in the provision of test and tooling solutions and to better position the Group to capture any new business opportunity, in a fast changing landscape.
    The integration exercise is expected to be completed before end of the year.
  • In line with its expansion plan, TTS Taiwan has moved to a bigger facility in Hsinchu. The new office, housing the sales, application and design centre, is within a 5 mins walking distance from the Hsinchu HSR Station. In conjunction with the Semicon Show Taiwan, the new office was officially declared open by the Group CEO and we are glad to receive our first visitor from Toshiba Japan. Our office is located at 8F-3, No.229, Fuxing 2nd Rd., Zhubei City, Hsinchu (新竹縣竹北市復興二路229號8樓之3)
  • TTSG today announces the successful registration of the company logo and tagline. The trade mark is granted under the registration number 2012018638 for a period of 10 years.
2013

2013 Highlights

  • TTSG has been granted the patent for its new probe pin design in Japan. This new probe pin design has a longer spring coil that tapered gradually to reduce stress and improve the electrical performance as well as life span of the pin.
2012

2012 Highlights

  • TTSG is pleased to introduce the new green logo and tagline- feel green, live green and be green ©
  • Received an award from Broadcom Inc in recognition of our outstanding service and support
  • TTSG has acquired another 10 units of brand new CNC machines from Citizen and Fanuc with a list price of more than USD1 million as part of the expansion plan
  • TTSG has been granted the patent for Offset Taper Spring (OTS) by the United States Patent and Trademark Office (USPTO) filed on Dec 27, 2011
2011

2011 Highlights

  • Setup secondary processing plant in JB
  • Expansion of TTS Thailand to double the capacity
  • Launch of New Corporate Branding
  • Arrival of 10 more new Citizen machines, latest model auto lathe machines from Japan as part of the overall expansion plan for 2011
  • Integration of Kenstronics Malaysia with Test Tooling Solutions Group
2010

2010 Highlights

  • Expansion of TTS Japan to a new office at Kawasaki, Kanagawa, Japan
2009

2009 Highlights

  • Launched first Intranet to enable employees to share, view and locate company/department's information
  • 5S implementation to approach for productivity, quality and safety improvement into the production floor
  • Test Tooling Solutions (TTSM) and Test Tooling Designs (TTDM) have achieved the certification of ISO 9001:2008 for Quality Systems
2008

2008 Highlights

  • Obtained the certification for RoHS (Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) for its Test Probe
  • Acquired 100% of the R-Squared Circuits Inc, a Printed Circuit Board Manufacturer for ATE testers located in Folsom California
2007

2007 Highlights

  • Setup Auto Lathe factory in JB
  • TTSM officially took possession of Plant A in Penang
2006

2006 Highlights

  • Purchased 50,000 sq. ft of a new production facility in Johor, Malaysia
  • Completed the expansion and renovation of Plant B in Penang
  • Acquired BigHub Technology Sdn Bhd and change its name to Test Tooling Designs (M) Sdn Bhd (TTDM)
  • Established its wholly owned subsidiary in Malaysia, Test Tooling Solutions (M) Sdn. Bhd. (TTSM)
  • Incorporated Test Tooling Solutions Group Pte Ltd in Singapore (TTS Group)
  • Relocation of Corporate HQ from USA to Singapore

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