News & Events

Fri, 24 Jul 2009

Test Tooling Solutions (TTSM) and Test Tooling Designs (TTDM) have achieved another milestone and recognition in this industry with the new version certification of ISO 9001:2008 for Quality Systems. With this certification, our customer can be assured of the good quality of our products and services.

Wed, 22 Jul 2009

TTS will like to thank all customers and suppliers for dropping by. It is a fruitful event as TTS was able to discuss various test issues and future challenges with prospective customers cum partners. We hope to see you again next year in SEMICON West 2010. Thank you again.

Tue, 2 Jun 2009

Come and Visit us at SEMICON West in July 2009. For the upcoming event from 14th July to 16th July, please drop by our booth #520 at South Hall. We are showcasing our latest 0.3mm pitch Test Probe & Socket , Air Gap Contactor , CIS socket as well as MCC Board. You will have the opportunity to discuss your specific requirements with our Sales Application Engineers on site.

Fri, 27 Mar 2009

TTS Group took part in the SEMICON China exhibition from 17th to 19th of March, one of the biggest semiconductor exhibition in the China. The booth, which showcased the latest 0.2mm pitch Test Socket, Test Probe, Burn-In Board, Load Board, R&D Simulation etc, received more than 400 visitors from the semiconductors industry during the 3 days exhibition. We would like to thank all the prospects, customers and vendors who visited our booth during the show.

Fri, 27 Feb 2009

Come and Visit us at SEMICON China in March 2009. For the upcoming event from 17th March to 19th March, please drop by our booth #2653 at Hall W2. We are showcasing our latest in Test Probe & Socket Design and Fabrication as well as BIB and ATE Boards. You will have the opportunity to discuss your specific requirements with our Application Engineers on site.

Wed, 3 Dec 2008

Join Us at Semicon japan 2008

Booth No: 11D-809

Location: Makuhari Messe, Chiba Japan

Fri, 28 Nov 2008

TTSM is expected to take delivery of the 10 new Tsugami’s latest auto lathe machines with a list price of Yen12 millions each (about USD120K) from December onward. The first machine is scheduled to arrive at the factory in Johor, Malaysia at the end of December with the rest to follow in January 2009. This is part of the an overall investment of USD6MM to upgrade the current probe pin fabricating facility in Johor and to position the company for the potential economy recovery.

Fri, 21 Nov 2008

Test Tooling Solutions Group announced additional equipment purchases with list price exceeding USD1MM. This is part of an overall investment of not less than USD2MM in the PCB Fabrication facility to upgrade its manufacturing capability for high end ATE boards. The equipment is expected to be delivered over the next 2 to 3 months, demonstrating the management’s commitment to the facility in Folsom, California and confident of the high end PCB industry in the USA.

Thu, 25 Sep 2008

Mr. Gary Ford was appointed Vice President and Managing Director for Test Tooling Solutions Group, North America. Gary has more than 20 years of experience in the PCB Industry with different levels of appointment. He oversees our Group’s PCB fabrication facility in Folsom, California and reports to the Snr VP for PCB Division.

Mon, 4 Aug 2008

Branding Seminar

TTSG had on 4 August 2008 (Monday) organized a one day branding seminar for the Management Team. Mr. Wilson Chew, the Principal Consultant & CEO of Strategicom & his partner Mr. Stefan Pertz were engaged to provide an overview on the importance of branding and how it can impact the business of TTSG. The Management Team walked away with a good sense of things that need to be done to better position the Group in a challenging business environment.