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Test Socket And Accessories Enquiry

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Please in the respective boxes

1. Device Form Factor : BGA LGA PGA QFP Others

2. Array Pitch (mm) : 0.5 0.8 1.0 1.27 Others

3. Package Size : mm by mm

4. Total Number of Balls / Leads / Lands in device package :

4a. For BGA: a) Ball Diameter (mm):		b) Ball Height (mm):
4b. For LGA: a) Land Diameter (mm):		b) Land Height (mm):
4c. For PGA: a) Pin Diameter (mm):		b) Pin Height (mm):

5. Substract Height / Thickness (mm):

6. Test Contractor Length (X): Width (Y): Height (Z):

7. No. Of Pin Holes required on Top side of Test Contactor:

8. Test Contactor base material:

9. No. Of Pin Holes required on PCB side of Test Contactor:

10. Operating test speeds, or other electrical parameters:

11. Does socket mount directly to DUT Board? If not, please explain alternate mounting:

12. Operating Temperature : °C(low) to ± °C(high)

13. Socket Prototype Quantity : pcs Production Quantity (Est): pcs

14. Handler and Tester used for this application:
i)Handler type: ii)Tester type:

15. Hand Socket Lid Clip-On Lid (Removable) for initial setup of tester in automated
environment
Style Clam-Shell Lid (Attachable) for manual testing

16. Hand Socket Lid Quantity:

17. Thermal Solution (with Heat-sink) required : Yes*      No
      * If Yes, please provide DIE size: mm (L)    by mm (W)    by mm (H)

      Thermocouple hole required : Yes*      No
      * If Yes, please specify thread size and depth dimensions:


      Are any custom lid features required? Please explain:

18. Define any other custom requests or comments:

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