| Capabilities |
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50+ Layers |
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High Aspect Ratios (33:1) |
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Smallest mechanical drill size (.0059”) |
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Fine Line (.003”) |
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0.5mm BGA |
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Maximum thickness .250” |
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Maximum PCB Finished Size 22.5 x 26” |
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| Engineering Services and Consulting |
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Impedance Modeling - Polar Si8000 |
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Layer Stack Up Generation – Polar Speedstack PCB |
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Material and Process selection or development |
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Design Rule Check (DRC) |
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Design for Manufacturing (DFM) verification |
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| Processes |
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Via-in-Pad (Filled & Plated Vias) |
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Vacuum Sealed Vias |
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Mixed Dielectrics |
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Blind/Buried Vias |
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Sequential Lamination |
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Cap Lamination |
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Controlled Depth Drilling (Back-Drilling) |
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| PCB Finishing |
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LPI Soldermask (Red, Blue, Green) |
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Epoxy Ink (White, Red, Yellow, Blue, Black, Green) |
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Electroplated Nickel and Gold |
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Selective Gold Plating |
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| Testing |
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IPC Netlist Testing |
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Flying Probe Tester |
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Impedance Verification – Polar CITS900s4 |