| Capabilities |
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ATE Load Boards, Probe Cards, Burn-In, Interfaces |
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RF, Mixed Signal, and High Speed PCBs |
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Circuit Simulation |
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DFM (Design for Manufacturability) Processes and Technologies selected for performance and application |
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Research and Development Projects |
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| Experienced Team |
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Applications Engineers |
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PCB Designers |
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Manufacturing and Assembly Engineers |
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| PCB CAD Software |
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Cadence Concept (Schematic Capture) |
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Cadence Allegro (PCB Layout) |
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Ansoft HFSS (Circuit Simulation) |
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| Technologies |
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Buried, Blind, Back-Drilled Vias |
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Mixed Dielectrics |
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Embedded Components |
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High Aspect Ratios |
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Micro-Strip and Stripline Impedance |