| 能力 |
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50+層 [ 50+ Layers ] |
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最小電鍍微孔高寬比 (33:1) [ High Aspect Ratios (33:1) ] |
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最小鑽孔(.0059”) Smallest Mechanical Drill Size (0.059”) [ Micro-Drilling (.0059”) ] |
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精密線 (.003”) [ Fine Line (.003”) ] |
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0.5mm BGA [ 0.5mm BGA ] |
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最大板厚 [ Maximum thickness 0.25” ] |
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最大板面 [ Maximum PCB Finished Size 22.5”x 26” ] |
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| 工程服務及諮詢服務 |
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阻擾配套的設計修改 [ Impedance Modeling – Polar Si8000 ] |
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疊層方案 [ Layer Stack Up Generation – Polar Speedstack PCB ] |
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材料和流程選擇或發展 [ Material and Process selection or development ] |
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設計規格檢查 [ Design Rule Check (DRC) ] |
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設計製造業證明 [ Design for Manufacturing (DFM) Verification ] |
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| 流程 |
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隱藏性微導孔 [ Via-in-Pad (Filled & Plated Vias) ] |
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真空密封過孔 [ Vacuum Sealed Vias ] |
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混合基板 [ Mixed Dielectrics ] |
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盲導孔/埋導孔 [ Blind/Buried Vias ] |
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順序層壓 [ Sequential Lamination ] |
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帽層壓 [ Cap Lamination ] |
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深度控制鑽孔(雙面鑽微孔) [ Controlled Depth Drilling (Back-Drilling) ] |
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| 整理印刷電路板 |
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LPI防焊濕膜（紅，藍，綠） [ LPI Soldermask(Red,Blue,Green) ] |
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環氧油墨(白，紅，黃，藍，黑，綠)[ Epoxy Ink(White,Red,Yellow,Blue,Black,Green) ] |
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鎳與鍍金 [ Electroplated Nickel and Gold ] |
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彈性表面鍍金 [ Selective Gold Plating ] |
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| 測試 |
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IPC原設計匹配 [ IPC Netlist Testing ] |
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飛針測試 [ Flying Probe Tester ] |
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阻擾驗定 [ Impedance Verification – Polar CITS900s4 ] |