| 能力 |
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50+ 层 [ 50+ Layers ] |
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最小电镀微孔高宽比 (33:1) [ High Aspect Ratios (33:1) ] |
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最小钻孔(.0059”) Smallest Mechanical Drill Size (0.059”) [ Micro-Drilling (.0059”) ] |
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精密线 (.003”) [ Fine Line (.003”) ] |
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0.5mm BGA [ 0.5mm BGA ] |
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最大板厚 [ Maximum thickness 0.25” ] |
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最大板面 [ Maximum PCB Finished Size 22.5”x 26” ] |
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| 工程服务及咨询服务 |
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阻扰配套的设计修改 [ Impedance Modeling – Polar Si8000 ] |
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叠层方案 [ Layer Stack Up Generation – Polar Speedstack PCB ] |
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材料和流程选择或发展 [ Material and Process selection or development ] |
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设计规格检查 [ Design Rule Check (DRC) ] |
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设计制造业证明 [ Design for Manufacturing (DFM) Verification ] |
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| 流程 |
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隐藏性微导孔 [ Via-in-Pad (Filled & Plated Vias) ] |
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真空密封过孔 [ Vacuum Sealed Vias ] |
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混合基板 [ Mixed Dielectrics ] |
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盲导孔/埋导孔 [ Blind/Buried Vias ] |
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顺序层压 [ Sequential Lamination ] |
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帽层压 [ Cap Lamination ] |
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深度控制钻孔(双面钻微孔) [ Controlled Depth Drilling (Back-Drilling) ] |
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| 整理印刷电路板 |
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LPI 防焊湿膜（红，蓝，绿） [ LPI Soldermask(Red,Blue,Green) ] |
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环氧油墨(白，红，黄，蓝，黑，绿)[ Epoxy Ink(White,Red,Yellow,Blue,Black,Green) ] |
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镍与镀金 [ Electroplated Nickel and Gold ] |
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弹性表面镀金 [ Selective Gold Plating ] |
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| 测试 |
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IPC原设计匹配 [ IPC Netlist Testing ] |
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飞针测试 [ Flying Probe Tester ] |
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阻扰验定 [ Impedance Verification – Polar CITS900s4 ] |