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  BGA Photo 0.2mm pitch RF Test Socket for BGA devices
TTS launches the 0.2 mm pitch RF socket for BGA, CSP, QFN, QFP devices & etc., to reduce the socket pitch to meets the growing need on fine pitch devices. It is able to meet a wide range of high-speed, high - density fine pitch socket requirements. 0.12mm spring probe pin is used inside the 0.2mm pitch socket. The spring probe can be applied to Kelvin Test Socket as well.
 
  Singapore
May 21, 2012 at 09:45
  Penang, Malaysia
May 21, 2012 at 09:45
  Suzhou, China
May 21, 2012 at 09:45
  London, UK
May 21, 2012 at 02:45
  Santa Clara, USA
May 20, 2012 at 18:45 PST
  Bangkok, Thailand
May 21, 2012 at 08:45
  Tokyo, Japan
May 21, 2012 at 10:45
  Taipei, Taiwan
May 21, 2012 at 09:45
 
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